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Conferences & Symposiums

International Conference on Solid Waste 2013 - Innovation in Technology and Management

Date, time & venue

2013-05-05;5-8 May 2013;The Hong Kong Exhibtion and Convention Centre, Wan Chai


The International Conference on Solid Waste 2013

Public Forum on Thermal Technology for Waste Management in Metropolises

May 5 - 8 , 2013


(EVD is a supporting organisation to this Symposium)

Aim of the Forum
Thermal treatment technology is gaining momentum around the world in order to meet the challenges in the disposal of ever-increasing volumes of municipal solid waste (MSW) simultaneously producing energy. Despite the wide application of combustion-based treatment technologies, still the acceptance of these technologies by the public is a major factor of concern.  This public forum focuses on revealing the myths & facts, pros & cons, developments in pollution abatement systems and the current status of different thermal technologies. Expert panelists will deliver short presentation and open for the discussion with the participants. We invite you to participate, actively deliberate, understand the current status of the thermal technologies and appraise yourself on the applicability of these technologies to Hong Kong.

Forum Panelists (Tentative Topics)
Mr. Elvis Au, Assistant Director, HKEPD, HKSAR Government
Topic: Requirements for Large Scale Treatment of Municipal Solid Waste in Hong Kong

Prof. Nickolas Themelis, Chair, Waste to Energy Research and Technology Council, USA
Topic: International Scenario of Thermal Treatment Technologies

Prof. Umberto Arena, Chair, Specialist Group on Waste to Energy, IWWG, Second University of Naples, Italy
Topic: Advanced Thermal Treatment Technologies

Mr. Erik Koldenhof, CEO, Afval Energie Bedrijf, the Netherlands
Topic: Netherlands Experience in Waste to Energy

Dr. Lee Potts, Technical Manager (Energy), AECOM
Topic: Review of Thermal Treatment Technology for Municipal Solid Waste

Forum Details
Date: 7th May 2013 (Tuesday)
Time: 17:00 – 19:00
Venue: Room No. S421, Hong Kong Convention and Exhibition Centre, Wan Chai
Fee: Free admission on a first come first serve basis
The Forum will be conducted in English.

Program rundown: See attached

Registration: If you wish to join the conference but have not registered yet, please take action right now at:  or download the registration form by clicking the "folder" icon on right upper corner




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